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Projektleiter Wafer Level Packaging Senior/Staff Engineer (f/m/d)- Munich, Germany

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Offered by:

Qualcomm

Engineering
Munich


Company:

RF360 Europe GmbH

Job Area:

Engineering Group, Engineering Group > Hardware Engineering
General Summary RF360

Tasks:

  • Management of demanding and cross-location technology projects in the area of wafer level packaging
  • Development, definition and qualification of complex process sequences, also in cooperation with foreign locations
  • Planning, coordinating and tracking the activities of project members
  • Communication with the involved locations
  • Presentation of the results in management meetings; Creation of project documentation;

Required education:

  • Successfully completed studies in the field of physics / microsystems technology / process engineering / chemistry


Required kledge:

  • In-depth kledge of the processes and processing of wafer level packages
  • Several years of professional experience in manufacturing and / or in process / technology development
  • Purposeful, careful and organized way of working
  • Experience in developing processes or process sequences
  • Very good communication skills
  • Ability to work in a team
  • Very good written and spoken English

What's an Offer/ Benefits:

Apart from working in an open, relaxed and collaborative space, you will enjoy:

  • Employer-financed pension schemes
  • Employee Stock Purchase Plan (ESPP)
  • Intensive onboarding training
  • Staff canteen
  • Company Medical Officer on site
  • Further training opportunities
  • Excellent central location in Munich, in walking distance to Ostbahnhof / Werksviertel


You will become part of a highly motivated and experienced team that works together from several locations around the world.
We are looking forward to your complete and compelling application!

Minimum Qualifications

Education: Bachelors - Computer Science, Bachelors - Engineering, Bachelors - Information Systems
Work Experiences: 5+ years Hardware Engineering experience or related work experience.
Certifications:
Skills:

Preferred Qualifications

Education: Masters - Computer Science, Masters - Engineering, Masters - Information Systems
Work Experiences: 1+ years in a technical leadership role with or without direct reports. ,2+ years experience with hardware design and measurement instruments such as oscilloscopes, spectrum analyzers, RF tools, etc. ,2+ years experience utilizing schematic capture and circuit simulation software. ,2+ years experience with circuit design (e.g., digital, analog, RF). ,8+ years Hardware Engineering experience or related work experience.
Certifications:
Skills: Computer Science, DSP Architectures, Electrical Engineering, Optical Systems, Packaging Systems

  • References to a particular number of years experience are for indicative purposes only. Applications from candidates with equivalent experience will be considered, provided that the candidate can demonstrate an ability to fulfill the principal duties of the role and possesses the required competencies.


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